DFI-ITOX

Piscataway,  NJ 
United States
http://www.dfi-itox.com
  • Booth: 4209

Founded in 1981, DFI is a global leading provider of high-performance computing technology across multiple embedded industries. With its innovative design and premium quality management system, DFI’s medical computing solutions enable customers to optimize their equipment and ensure high reliability, long-term life cycle, and 24/7 durability in a breadth of medical markets including healthcare information system, ultrasound system, X-ray scanner, CT/MRI system and so on.


 Press Releases

  • What's More Thrilling -
    DFI's New Products with 7th Gen Intel® Core™ Processors
    DFI’s upcoming boards with 7th Generation Intel® Core™ processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.
    Remarkable and Improved Interfaces
    DDR4: High Speed Transmission with Low Power
    DDR4 is loaded with excellent features that enhance speed, power, and reliability   for a variety of applications. With clock rates reaching 2400/2133 MHz and capacity reaching 16GB, the performance of DDR4 has increased up to 50% over DDR3. Thanks to a 20% reduction in voltage, total overall power savings can be reduced up to 35%.
    Support High Bandwidth Interfaces: USB3.0, SATA III, PCIe 3.0
    New series board is designed with multiple high bandwidth interfaces on a single board. USB 3.0 offers transfer rates of 5 Gbps, which is 10 times faster than USB 2.0. PCIe Gen3 allows the transmission of data at 8Gb/s speeds and SATA III at 6 GB/s, resulting in faster and higher performances. With perfect board allocation and optimized thermal analysis, DFI’s board will not overheat even in the process of high-performance computing.
    Overall Performance and Productivity Improvements with M.2 Interface
    Up-to-date M.2 interface delivers data transfer speeds of 16Gb/s using Gen3 x2, which is more than 2 times faster than a conventional SATA III
     connection. The products of new series with brand-new M.2 deliver high-performance, quick responsiveness, and bring large storage capacity to meet clients’ needs.
    Unexpected incidents such as extreme environment changes, severe shock, and electric shock often result in serious and underestimated harm to enhance the reliability and extend longevity, DFI promises that all our products will undergo several stricter tests that reduce failure rate and enhance stability of operation in the harshest environment.
     New Embedded Boards Available Now
     
     
     
     
  • DFI has launched new industrial motherboards powered by the latest Intel® Atom™ processor E3900 family (code name Apollo Lake). For the new series boards, DFI has created a wide array of rugged and reliable products including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1, and SMARC R2.0. These boards deliver higher computing capabilities and stunning graphics performance at economically low-power consumption that average at only 9 watts TDP. Moreover, they support the extended temperature range from -40°C up to +85°C, which provide appropriate industrial hardware in embedded applications such as transportation, automation, energy, military or aerospace.
    Comparison
    Key Features
     
    Equipped with industrial-grade components, these boards support a wide temperature range of -40 to 85°C durable for any industrial and harsh environments.
     
    The new series powered by enhanced graphic engine supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for multimedia solution.
    New design on embedded boards: proprietary EI/O extension interface to provide flexibility; up-to-date M.2 interface for high-speed storage; advanced thermal solution that makes good system integration.
    DFI’s Embedded Boards (in Availability Now)
       

    DFI Inc.

    10F, No. 97, Sec.1, Xintai 5th Rd. Xizhi Dist., New Taipei City 22175 Taiwan (R.O.C.)
    Tel: +886 (2) 2697-2986 / Fax: +886 (2) 2697-2168 / www.dfi.com
          Copyright © 2017 DFI Inc. All rights reserved. 
          For more information, please contact your DFI regional salesrepresentative or send us an email : inquiry@dfi.com
  • Can DFI propel customers to the next level with the new SBC?
    The newly launched SBC performed excellently in the market. The combination of the 6th generation Intel® Core™ processor and DFI’s high quality production ensures that the new SBC is equipped with high speed CPU performance, powerful 4K-capable graphics, DDR4, and Windows 10 support. Moreover, DFI’s new SBC products have various dual or quad processors options that enable clients to have a suitable motherboard that fits their needs. DFI has devoted numerous efforts integrating and optimizing the functionalities of their SBCs, therefore differentiating themselve from other competitors. This begs the question: how does DFI deliver more optimal solution with the 6th generation Intel® Core™ processor in their SBC products when compared with their competitors?
    As mentioned above, DFI’s new SBC products (such as SU551SU251/253) can be perfectly applied in space-constrained industrial environments that require fast and stable computing capabilities. To completely meet customers’ needs, DFI is not only able to maintain previous SBC generations’ excellent features (such as rich I/O ports), but is also able to provide customized Expansion I/O port that can satisfy additional requirements and optimize solutions for various applications in a cost-effective way. Firstly, regarding the heat dissipation capacity with the special design of placing the processor on the back of the board, making it closer to the enclosure of case, the new SBC can now run up to 100% CPU capacity consistently without overheating. Secondly, and perhaps even more noteworthy, DFI has adopted FloTHERMAL as its electronic thermal analysis tool to predict airflow, temperature, and heat transfer in and around components, boards, and electronic equipment. With the strict FloTHERMAL software, DFI developed the optimized proprietary heat spreading technology and ensured that the new SBC could dissipate heat at an accelerated speed.
       
    To increase the flexibility for the design of embedded solutions within limited space, DFI’s new SBC supports three types of power connectors (including DC Jack, vertical type, and right angle type) to ensure minimum requirement of space for DC-in. The 6 OS that the new SBC supports (including Windows 7, Windows 8.1, Windows 10, Debian 8, CentOS 7, and Ubuntu 15.10) allow clients to select the one that is most suitable for their solutions. Moreover, we also provide demo images from Linux to Windows OS to help clients integrate their system faster and easier. To sum up, DFI steadfastly considers various requirements in order to produce the best SBC for different applications. 

    The SBC embedded with the new 6th Generation Intel® CoreTM Processor is DFI’s answer to space-limited environments that requires excellent performance, for instance, Automated Guided Vehicles (AGV), and robotic arm control. With MTBF of more than 100K hours and an organizational goal to keep the DPPM under 200, DFI’s new SBC is built with both premium features and reliable qualities to meet clients’ needs.



       
     
     


     
     
  • Small and Lightweight, but Powerful! Why Not?
    Fanless Embedded Box PCs Boost Performance in Industrial Machines
    DFI (a leading provider offering a wide range of embedded products for industrial applications) has been dedicated to developing trusted and rugged industrial box PCs to collect and process data generated by numerous connected machines. Which poses a real challenge for today’s system integrators and application developers. 
    DFI’s fanless and compact embedded box PCs are designed with industrial-strength components and soldered-down CPU and memory in order to bring enhanced reliability and stability in harsh operating environment. In addition, leveraging DFI's proprietary heat dissipation technology, the IPCs adopted fanless design not only allows the systems to perform in extreme temperature conditions, but also reduces active components for longer product lifecycle and simpler maintenance. Since there are a few challenges (such as extreme temperature, dust, and power supply limitation that can create issues for industrial equipment) the mechanical design of embedded PCs must be durable and robust under such demanding conditions on the shop floor. Also, due to the fact that most space in equipment is occupied by machine elements, the installation for box PCs is restricted to a very limited area. DFI’s versatile compact fanless industrial PCs provide outstanding processing capability and power efficiency in an ultra-small size to integrate with production machines and proactively optimize the factories operations.
    “DFI’s fanless, lightweight, and compact box PCs product portfolio is targeted for a large variety of industrial control applications and deploys exceptional scalability by featuring entry-level (low-power Intel® Atom™ processor) to high-end platforms (6th Gen Intel® Core™ processor) to consolidate and engage in embedded solutions with a variety of requirements.” said GS Liu, DFI’s system product planning leader. “When designing this series, we combined many factors such as wide power input for plant uses, extended temperature support for critical systems, wireless connectivity that offers seamless valuable data transition, and substantial I/O ports with high flexibility to ensure that the box PCs would meet and exceed industry standards for ruggedness and reliability while still delivering the performance that our customers expect.”

    Thanks to these brilliant features, the small but powerful IPCs can help customers optimize their equipment performances and strengthen reliability and responsiveness to an array of smart solutions, such as smart factory, digital healthcare, and IoT gateways.
    High-Performance: EC70A-SU
    As a flawless combination of impressive stylish design and excellent computing capability, EC70A-SU brings a whole new concept to the IPC market. Based on the high-end 6th Gen Intel® Core™ i7/i5/i3 processors, it delivers outstanding processing capability in a fanless and compact enclosure. And it is designed for space-limited and compute-intensive solutions like smart factory, digital healthcare, and surveillance.
    Deeply-Embedded: EC700-BT
    The EC700-BT takes full advantage of the Intel® Atom™ E3800 processor, which is packed with extensive I/O capabilities and extended operating temperatures to provide advanced endurance and high scalability. Making the box PC ideal for harsh environments such as industrial automation and transportation.
    Entry-Level: EC800-CD
    DFI’s palm-sized and ultra-compact embedded box PC, EC800-CD, is powered by low-power and energy-efficient Intel® Atom™ processor N2000/D2000 series. To ensure productive communication, the system supports Wi-Fi and 3G via optional modules for embedded applications that require wireless and mobility including retails and IoT networks.
     
     
     
    DFI’s EC70A-SU, available this fall, is the world’s smallest fanless and lightweight embedded box PC based on 6th Generation Intel Core processors. Featuring significantly improved performance and all-new rugged ID design to offer system providers a perfect choice to their embedded solutions. 

    Want More Information?
    Just leave your name and email below, and you’ll be the first to learn about special events, sample availability and latest information about EC70A-SU.
     
    About DFI

    Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 35 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

    *Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.
    Contact Us
     
    DFI Inc.
    10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
    Tel: +886 (2) 2697 2986   E-mail: inquiry@dfi.com   E-Store: estore.dfi.com

    DFI-ITOX, LLC
    15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
    +1 (732) 390 2815 
    DFI Technologies LLC
    1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
    +(916) 568-1234

     
    Diamond Flower Information(NL) B.V.
    Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands
    +31 (10) 313 4100

    DFI Co., Ltd.
    5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
    +81 (3) 5209 1081

    Yan Ying Hao Trading Co. Ltd. (ShenZhen)
    Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
    Bao'an Road, Bao'an 42th District, ShenZhen, China
    +86 (0755) 2372 9390
  • Don’t compromise performance for thinness! 
    The “thin” you should know to empower your business
    Thin is in. This is one of the biggest trends in industrial computing applications. DFI, as a leading provider of embedded solutions, is now providing industrial-grade Thin Mini-ITX motherboards that feature the new 6th Generation Intel® CoreTM Processor and Intel® Pentium®/Celeron® Processor N3000 Product Family.

    DFI’s Thin Mini-ITX boards are beneficial in space-limited environment due to the rich I/O ports and slim-size. As the equipment had to be a slim footprint to achieve space saving in a narrow occasion, Thin Mini-ITX Boards are becoming the most powerful and thinnest modules in its class on the market today.
    Slim Design with Rich I/O Ports and Excellent Thermal Solution Meet Client Expectations
    In order to fulfill the requirements for application in limited-space environment (such as digital signage, healthcare, surveillance, and power & energy industry) ,DFI dictates that all thin-sized boards must measure less than 25mm with I/O shield, but designed with a multitude of I/O ports. Based on the board space and height limitation, the majority of industrial boards are unable to support rich I/O ports. However, with the DFI qualified board’s lay-out capability, DFI’s thin boards can support three independent displays via HDMI, LVDS, VGA, DVI or DP, and simultaneously support up to 9 USB 3.0/2.0 ports, 4 COM ports, and rich expansion slots. Having that said, DFI is aiming to build a powerful thin board that can help users operate facilities in a more flexible way. Low maintenance and high level of robustness without vulnerable fans are becoming essential to pursuit year-long reliable usage. Under the high performance of CPU, our Thin Mini-ITX Motherboards come with new proprietary heat spreader technology to reduce the height of the board, and it also further support thin boards to be more flexible in a variety of applications, including low noise-level and narrow conditions. With brilliant Thermal solutions built right into Thin Mini-ITX Board, we successfully exclude superheated operating and fulfill diversity of needs.
    Diversity platforms across our Thin Mini-ITX boards brings out Dominance

    In mainstream healthcare, gaming, digital signage, retail, and transportation, different environment request distinctive performance and efficiency. DFI’s Thin Mini-ITX boards are embedded with versatile Intel platforms that bring scalable performance from entry-level to premiere-level. We devoted considerable effort in fulfilling multiple kinds of demands. To further meet the demanding needs of high graphics and performance, we leverage the performance not only on the processor side through core evolution, but also feature Intel HD graphics that bringing eye-catching graphics to thinner and lighter boards. Meanwhile, the Thin Mini-ITX boards combined with the low power consumption of advanced processor can support long battery life, which is integral in delivering high-value and high efficiency. From digital signage and gaming kiosks to facilities in retail, transportation, and factory settings, the offer of longevity and high-end graphics makes our Thin Boards well-suited for a wide range of applications.
    DFI optimized Thin Mini-ITX solutions to offer partners an outstanding quality boards

    Since the medical equipment is used in cramped input terminals or narrow bed-side workstations (such as clinic information systems, patient data management systems, radiology information systems, picture archiving and communication systems) they seek slimmer devices to build more commodious space. Apart from the slim form factor, the high-efficiency and high-graphics were requirements needed to deliver advanced performances for applications in operating rooms, surgical intervention rooms, and recovery rooms. Due to those requirements, our thin Mini-ITX is the most suitable choice for applications that need thin-sized board, high performance, and rich I/O ports. With rich I/O ports, we can strongly support a healthcare device that is connected to more than one operating panels, leading to flexible space utilization.
    To achieve the goal of delivering premium quality products to partners and consumers while meeting their demands, DFI is continuously innovating and making all efforts to develop first-class thin Mini-ITX boards.
                                     SD101/103
                                        SU171/173
     
     
                                                                       BW171/173
    HU101/103
    HU171/173
    BT101/103
    BT160
    BT161
    KB160
    KB161
    Contact Us
     
    DFI Inc.
    10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
    Tel: +886 (2) 2697 2986   E-mail: inquiry@dfi.com.tw   E-Store: estore.dfi.com

    DFI-ITOX, LLC
    15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
    +1 (732) 390 2815 
    DFI Technologies LLC
    1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
    +(916) 568-1234

     
    Diamond Flower Information(NL) B.V.
    Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands
    +31 (10) 313 4100

    DFI Co., Ltd.
    5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
    +81 (3) 5209 1081

    Yan Ying Hao Trading Co. Ltd. (ShenZhen)
    Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
    Bao'an Road, Bao'an 42th District, ShenZhen, China
    +86 (0755) 2372 9390
  •  
    DFI IoT Possibilities
    Providing Windows 10 Compatibility to Make OEM Clients Competitive
    【Taipei, Taiwan – April 27, 2016】- Internet of Things (IoT) is revolutionizing manufacturing and opening up new revenue opportunities for device OEMs. Being well aware of this mega-trend, DFI, a leader of embedded products for industrial application, has made its products Windows 10 ready to meet IoT demands. 

    In addition to supporting Windows 7 and Window 8.1, the company has added Windows 10 IoT compatibility to its latest board and system level products. Designed to propel IoT advancement, Windows 10 IoT offers a range of features and tools that allow device OEMs to quickly build powerful and connected devices for their customers. By making its products Windows 10 ready, DFI can better assist device OEMs across retail, manufacturing, healthcare, government, and other vertical sectors to develop and deploy IoT solutions.
    Three Windows 10 IoT Versions Catering to Different Applications
    Microsoft released three versions of Windows 10 IoT, each targeting at different user groups and for different application scenarios. These options give device OEMs added flexibility to choose the platform that best addresses their unique requirements. Whereas Windows 10 IoT Enterprise fits automation, digital signage, kiosk, ATM, and medical applications, Windows 10 IoT Mobile Enterprise is optimized for handheld devices, such as mobile point-of-sales units or barcode scanners. Last but not least, Windows 10 IoT Core is meant to target single-purpose, low-power devices such as micro-kiosks or IoT gateways.
    Streamline Development Process and Maximize Investments with “One Windows” that Scale Across Devices

    Windows 10 enables the creation of Universal Windows apps and drivers that run seamlessly on a broad range of devices –from compact, simple handheld POS units to larger, more sophisticated industrial robots. Moreover, all IoT functions of these devices can be deployed and managed in one development environment, Visual Studio. Since Windows 10 eliminates the redundancy of having to write separate apps and device drivers for every Windows version, developers can streamline development process and direct resources to mission-critical operations.
    Empowering the “I” in IoT: Create Device-to-Device and Device-to-Network Connections with AllJoyn Framework and Azure IoT Suite

    Windows 10 offers native support for the open-source AllJoyn, a unified protocol that all IoT devices can use to communicate and share functions. Windows 10 is also designed to work with Azure IoT Suite, which is a bundle of cloud based tools and services, to support secure device-to-cloud and cloud-to-device and connections. It makes monitoring, managing, and analyzing data generated from assets within a network much easier. The essence of IoT is “connectedness”; with AllJoyn and Azure IoT Suite, such connectedness on the device-level and network-level is made possible.
    Sign-Up Today to Pre-Order Your Samples

    Four Windows 10 compatible models, SD630, SD631, SD100, HD330, will be available at each DFI global branch office in mid-May for sample pre-order. If you would like to pre-order samples, please click on the "Sign-Up" button below and provide your contact information. Our sales representatives will be in touch with you to arrange the pre-order.

    The quantity of samples is limited, and pre-orders are processed on a first come, first serve basis, so sign up today!


     
    SD631


     
     
     
     
     
     
     
    As IoT is gaining much traction in the marketplace, having an IoT-enabled product portfolio can be a key market differentiator for OEMs. With a host of features, Windows 10 makes an ideal solution for crafting secure and powerful IoT applications and devices. By bringing Windows 10 compatible products on the table, DFI makes its clients more competitive.
    DFI Board and System Level Products that Support Windows 10:
    Board Level-Intel® Core™/Intel® Xeon®
    6th Gen Intel® Core™
    Motherboard
     
    SBC
    SU551 (3.5)SU251/253 (4”)
    COM Express
    SH960-QM170/HM170 (Basic)
    SU968 (Compact)
    4th Gen Intel® Core™/4th Gen Intel® Xeon®

    Motherboard
    HD100-H81
    HD330-H81/Q87
    HD630-H81
    HD631-Q87
    HD632-H81
    DL310
    System Level-Intel® Core™
    4th Gen Intel® Core™
     
     
    Board Level-Intel® Pentium®/Celeron®/Intel® Atom™
    Intel® Pentium®/Celeron® Processor N3000
    Motherboard
    BW171/173
    BW051
    SBC
    BW551 (3.5”)
     
    COM Express
    BW968 (Compact)
    Intel® Atom™ Processor E3800
     
    Motherboard

    SBC
    BT253 (4”)
     
    Qseven 

    COM Express
    BT9A3 (Mini)
     
     
     
    System Level-Intel® Atom™ 
    Intel® Atom™ Processor E3800
     
    About DFI
    Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 35 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.
    *Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.
    Contact Us
     
    DFI Inc.
    10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
    Tel: +886 (2) 2697 2986  E-mail: inquiry@dfi.com.tw  E-Store: estore.dfi.com

    DFI-ITOX, LLC
    15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
    +1 (732) 390 2815 E-Store: dfi-itox.com/estore
    DFI Technologies LLC
    1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
    +(916) 568-1234

     
    Diamond Flower Information(NL) B.V.
    Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands
    +31 (10) 313 4100

    DFI Co., Ltd.
    5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
    +81 (3) 5209 1081

    Yan Ying Hao Trading Co. Ltd. (ShenZhen)
    Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
    Bao'an Road, Bao'an 42th District, ShenZhen, China
    +86 (0755) 2372 9390

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